Heads Up - Capacity with Confidence: The Chip-to-Grid Blueprint for AI Data Center Design

#1735163: Heads Up - Capacity with Confidence: The Chip-to-Grid Blueprint for AI Data Center Design

Description:	AI-driven data centers are evolving into utility-scale electrical infrastructures. As hyperscale facilities approach gigawatt demand, traditional siloed design approaches are no longer sufficient. To design with confidence in 2026 and beyond, engineering firms must adopt a holistic Chip-to-Grid perspective, integrating transmission planning, substation design, medium- and low-voltage distribution, and silicon-level workloads into one unified electrical model. In this session, John Francis presents a new approach to designing and analyzing AI Factory infrastructure. Learn how ETAP’s collaboration with NVIDIA enables high-fidelity digital twins and accelerated computing to simulate electrical, thermal, and mechanical interactions, allowing teams to validate performance, resiliency, and interconnection readiness earlier in the project lifecycle. This webinar is tailored for electrical consultants, EPCs, data center designers, grid interconnection engineers, and infrastructure planners working on next-generation AI facilities.
More info:	https://events.se.com/event/862be024-459f-45cb-89f7-0f08d9f49502/regProcessStep1?utm_source=sfmc&utm_medium=email&utm_campaign=invitation2&utm_id=invitation2&campaign_objective=consideration&mcl_name=df&subkey=548dd7e42fa15a5bb4046582cbb6f562997463f14599d9244012e07f97793ff7

Description:

AI-driven data centers are evolving into utility-scale electrical infrastructures. As hyperscale facilities approach gigawatt demand, traditional siloed design approaches are no longer sufficient.

To design with confidence in 2026 and beyond, engineering firms must adopt a holistic Chip-to-Grid perspective, integrating transmission planning, substation design, medium- and low-voltage distribution, and silicon-level workloads into one unified electrical model.

In this session, John Francis presents a new approach to designing and analyzing AI Factory infrastructure. Learn how ETAP’s collaboration with NVIDIA enables high-fidelity digital twins and accelerated computing to simulate electrical, thermal, and mechanical interactions, allowing teams to validate performance, resiliency, and interconnection readiness earlier in the project lifecycle.

This webinar is tailored for electrical consultants, EPCs, data center designers, grid interconnection engineers, and infrastructure planners working on next-generation AI facilities.

More info:

https://events.se.com/event/862be024-459f-45cb-89f7-0f08d9f49502/regProcessStep1?utm_source=sfmc&utm_medium=email&utm_campaign=invitation2&utm_id=invitation2&campaign_objective=consideration&mcl_name=df&subkey=548dd7e42fa15a5bb4046582cbb6f562997463f14599d9244012e07f97793ff7

Date added	April 29, 2026, 12:59 p.m.
Source	Events
Subjects	AI/ML - Artificial Intelligence / Machine Learning / GenAI / Artificial General Intelligence - AGI - Various Chips / Processors / hardware boards Manufacturers / Providers - Various (Also Geo Political!!) PodCasts / Webcast / Webinar / eSummit / Virtual Event etc. Semiconductor Industry News
Venue	April 30, 2026, midnight - April 30, 2026, midnight